Circuit Card Academy

Reference

Bench Mode

Glanceable lookup for the workbench — the numbers, codes and failure habits you need mid-repair. Power-off rules and program-specific values still apply; see each note.

First 5 minutes steps

Before any powered measurement. Eyes and process first.

  1. Strap on, tested, and logged before opening the tote. Handle the board by its edges.
  2. Read the work order / failure ticket fully. Note the expected current draw and any tighter-than-default rail specs.
  3. Confirm the board revision / dash number and pull the BOM for that exact rev. A 'same' board at a different rev may legitimately differ.
  4. Inspect under magnification with good lighting: burns, discolored mask, bulged or vented caps, cracked or cold joints, solder bridges, white flux haze, corrosion.
  5. Smell for burnt components and look for the crater a shorted tantalum leaves.
  6. Check connectors early: bent / recessed pins, fretting corrosion, cracked solder tails from cable strain. They are the #1 field-failure site.
  7. With power off, ohms / diode-test each rail to ground to find a dead short before you ever apply power.
  8. Write numbers down as you go. 'Rail was 4.82 V' is data; 'looked okay' is not.

Diode-test signatures table

DMM in diode mode sources ~1 mA and reads forward voltage. Power off, bulk caps discharged. Shorted junction = low both ways; open = OL both ways.

JunctionForwardReverseVerdict
Silicon (rectifier / signal)0.5–0.7 VOLHealthy
Schottky0.15–0.45 VOLHealthy — low forward is normal, not a defect
Germanium (old equipment)0.2–0.3 VOLHealthy
LED1.6–3.3 V (lights faintly)OLHealthy — blue/white may exceed some meters' test voltage
Zener (forward)0.5–0.7 V like siliconOLForward only — reverse breakdown needs applied voltage above its rating to verify
Any junctionlow (≈0 V)low (≈0 V)Shorted — lift one leg to rule out a parallel path
Any junctionOLOLOpen / dead

Logic-level thresholds table

A voltage is read as 1 or 0 against these thresholds. The band between LOW and HIGH is undefined — a signal loitering there (float, contention, weak driver) is itself a fault signature. Remember: a DMM averages, so a toggling line reads mid-rail too. Scope before declaring weirdness.

FamilySupplyInput LOW belowInput HIGH above
TTL5 V0.8 V2.0 V
LVTTL3.3 V0.8 V2.0 V
5 V CMOS (HC etc.)5 V~1.5 V (0.3×Vdd)~3.5 V (0.7×Vdd)
3.3 V LVCMOS3.3 V0.8 V2.0 V
Lower core rails2.5 / 1.8 / 1.2 Vproportional to Vddproportional to Vdd

Resistor color code (4-band & 5-band) table

4-band = digit, digit, multiplier, tolerance. 5-band (precision) = digit, digit, digit, multiplier, tolerance. Example: yellow-violet-red-gold = 47 × 100 = 4.7 kΩ ±5%.

ColorDigitMultiplierTolerance
Black0×1
Brown1×10±1%
Red2×100±2%
Orange3×1 k
Yellow4×10 k
Green5×100 k±0.5%
Blue6×1 M±0.25%
Violet7×10 M±0.1%
Gray8
White9
Gold×0.1±5%
Silver×0.01±10%

SMD resistor codes table

Chip resistors carry a printed code. Tiny 0201/0402 parts are unmarked — use the BOM.

NotationExampleReads asValue
3-digit47247 × 10²4.7 kΩ
3-digit10010 × 10⁰10 Ω
4-digit (1%)4702470 × 10²47 kΩ
R-notationR10decimal point at R0.10 Ω
R-notation4R7decimal point at R4.7 Ω
Zero-ohm jumper0 or 0000 Ω (link)

Capacitor 3-digit code table

First two digits = value, third = number of zeros, result in picofarads (pF). A trailing letter is the tolerance. Decoupling caps on logic rails are typically 100 nF (code 104).

CodeCalculationPicofaradsCommon name
10410 × 10⁴ pF100,000 pF100 nF (0.1 µF)
22322 × 10³ pF22,000 pF22 nF
10310 × 10³ pF10,000 pF10 nF
47447 × 10⁴ pF470,000 pF470 nF
10110 × 10¹ pF100 pF100 pF
47547 × 10⁵ pF4,700,000 pF4.7 µF

Polarity & pin-1 marks table

Recite this cold. Backwards installation is both something you must never do in rework and something to check for on a failed unit — assembly errors escape into the field.

PartMarkMeans
Aluminum electrolyticStripe on canNEGATIVE lead
TantalumStripe / barPOSITIVE lead ⚠ opposite of electrolytic
DiodeBandCathode
LEDFlat side / shorter leadCathode
DIP / SOIC / QFPDot or notchPin 1
BGACorner markBall A1

Reference-designator letters table

The letter prefix on a silkscreen designator tells you the component class at a glance.

LetterComponent
RResistor
RV / VRVariable resistor / potentiometer (VR also used for voltage regulator on some schematics — confirm from the part)
CCapacitor
LInductor / coil
FBFerrite bead
D / CRDiode (CR common on aerospace & mil schematics)
QTransistor (BJT / MOSFET)
UIntegrated circuit
YCrystal / oscillator
FFuse
KRelay
TTransformer
JJack / connector (fixed half)
PPlug / connector (mating half)
SSwitch
BTBattery
TPTest point

Failure modes by component table

Knowing the failure habits of each species is half the repair job. 'How it fails' is the habit; 'confirm' is the bench check.

ComponentHow it failsHow to confirm
Aluminum electrolyticDries with age/heat: capacitance drops, ESR rises (ripple, instability). Can also short. The #1 failing class.Bulged/vented top = dead, replace. ESR meter, or scope the rail ripple. Capacitance out of circuit.
TantalumFails SHORT, sometimes ignites. A burnt crater on the board is often a tantalum.Ohms / diode-test to ground reads near 0 Ω; visible char. Confirm by lifting a leg.
MLCC ceramicCracks from board flex or thermal shock → intermittent or short. Crack can be invisible.Classic 'rail reads ~0.5 Ω to ground'. Find by mV-gradient / thermal hunt, then lift to confirm.
MOSFETFails drain-source SHORT typically. Gate oxide is ESD-fragile.Diode-test: gate-to-anything should be open; D-S shows body diode one way. Near-0 Ω D-S = shorted.
TVS diodeFails SHORT after absorbing a transient — it did its job and saved the board.Diode-test reads short across the protected input/rail. Replace it AND find the transient source.
ViaCracked plated barrel from thermal cycling → intermittent: works cold, fails hot (or inverse), flex-sensitive.Continuity across the via while flexing / heating / freezing. Provoke and watch.
ConnectorBent/recessed pins, fretting corrosion, cracked solder tails from cable strain. #1 field-failure site.Visual under magnification; continuity pin-to-solder-tail; mV-drop under load on suspect contacts.
Crystal / oscillatorMechanically fragile — a dropped board with a dead clock is a prime suspect.Scope the oscillator output for correct frequency, amplitude, clean edges. Flatline = dead.
ResistorMostly fails OPEN or drifts HIGH, usually from an overload elsewhere — often the victim of a short.Reads higher than marked = suspect (parallel paths only lower readings). Find what killed it before re-powering.
Solder jointCold (gray, lumpy), cracked (annular ring around lead), insufficient/excess, tombstoned SMD. Most common assembly defect.Inspect under magnification per IPC-A-610. mV-drop under load or reflow-and-retest the suspect joint.

Power-rail check order & tolerance cards

Default rail tolerance is ±5% of nominal unless the drawing/test spec says tighter. Confirm rails are present, in tolerance, AND clean (scope the ripple). Modern boards have sequencing — check enable pins of any dead regulator.

Input / bus voltage
Per spec (e.g. 28 V aircraft bus)
Verify at the input connector first — fuse, connector, switch in the path.
Each regulator
Vin ≥ Vout + dropout
~2 V classic, ~0.1–0.5 V LDO. Insufficient headroom = starved, not broken.
Each rail DC level
Nominal ±5% (unless tighter)
DC-couple the scope: at nominal? Then AC-couple for ripple.
Rail ripple
Switching: low tens of mV. Linear: nearly flat.
AC-couple, 10–50 mV/div, 20 MHz BW limit. Growing ripple = dying bulk/output cap.
Supply current draw
Compare to test-spec expected
Way high = short. Way low = something not starting. Hiccup pulsing = current-limiting into a downstream short.
Switch node (SMPS)
Hard square waveform
No switching with good Vin + enable = controller. Switching but no output = inductor/rectifier/shorted output.

ESD & FOD bench rules steps

Static below ~3 kV (you can't feel it) destroys or latently wounds modern CMOS. A wounded part passes test and fails in flight — which is why these rules are absolute, not ceremonial.

  1. Wrist strap properly worn, connected, and tested (daily). The ~1 MΩ series resistor is for your safety — never substitute a plain wire.
  2. Work only at a protected station: dissipative mat, common-point ground, grounded iron tip, ESD smock.
  3. Keep insulators out of the ESD area — tape dispensers, foam cups, bubble wrap, synthetic fleece. They can't be grounded and field-zap parts at a distance.
  4. Boards travel in shielded bags or conductive totes — never bare-handed across the shop, never on random surfaces.
  5. Handle boards by the edges, away from connector pins and components. Remember dry air (winter) is ESD season.
  6. FOD: account for every tool and consumable; clean as you go; capture clipped leads, never flick them.
  7. A clipped lead, solder ball, or screw left inside an LRU becomes a flying short circuit — inspect the work area before closing any assembly.
  8. Report any unaccounted-for item immediately. Tool control (shadow boards, check-in/out) exists for this reason.

Generic expected values (textbook reference) table

GENERIC / TEXTBOOK starting points only — typical healthy values for orientation. PROGRAM-SPECIFIC values (rail nominals, tolerances, expected current draw, signature limits) MUST come from your own authorized documentation — the test spec, traveler, and BOM for this board revision — not from this table. When in doubt, stop and ask; an escape costs far more than a question.

QuantityGeneric / textbook value
Silicon junction forward drop0.5–0.7 V
Schottky forward drop0.15–0.45 V
Germanium forward drop0.2–0.3 V
LED forward drop1.6–3.3 V
TTL / LVTTL input thresholdsLOW < 0.8 V, HIGH > 2.0 V
5 V CMOS input thresholdsLOW < ~1.5 V, HIGH > ~3.5 V
3.3 V LVCMOS input thresholdsLOW < 0.8 V, HIGH > 2.0 V
Typical logic decoupling cap100 nF (0.1 µF) per IC supply pin
Linear regulator dropout (classic)~2 V
LDO dropout~0.1–0.5 V
Default rail tolerance±5% of nominal (unless spec is tighter)
Continuity beeper threshold~30–50 Ω (meter-dependent)